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HOME >> Product Information >> Functional Polymeric Materials & Products Division >> Heat Resistant Resin Compounds
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Heat Resistant Resin Compounds
   
MitsuiPESTM  (Polyethersulfone Compound)
Name and Structural Formula
Characteristics
Packaging
Application
Notes
MitsuiPESTM

High heat resistance
  (Tg225℃)
Dimensional stability method   
  (low warpage)
High-fluidity (fine molding)

Fire-resistant

Precision optical and electronic components (connector, socket)
OA precision equipment (gear, etc.)

Automotive mechanism component
 
SGN2020R
Glass fiber reinforced grade 25kg paper bag    
SGP2020R High-fluidity glass fiber reinforced grade 25kg paper bag    
SGF2030 Sliding glass fiber reinforced grade 25kg paper bag    
 
 
FR-TPXTM(Polymethylpentene Compound)
Name and Structural Formula
Characteristics
Packaging
Application
Notes
FR-TPXTM

High frequency characteristic (dielectric loss tangent: 0.0007)
High heat resistance (melting point 230°C, heat distortion temperature 175°C)
Thin-wall formability
 (Product thickness 0.1~0.2mm)
Chemical resistance, boiling water resistance, lightweight

Electric and electronic component
  (high-frequency coil bobbin, connector) Household electrical appliances  (microwave component, iron steamer)
 
T110 Glass fiber reinforced (GF15%) grade 20kg paper bag    
T130 Glass fiber reinforced (GF30%) grade 20kg paper bag    
     
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